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Plasma Analysis Software Product List

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[Case Study] Analysis of DLC Film Formation by Filtered Arc Deposition Method

[Case Study] Analysis of DLC Film Formation by Filtered Arc Deposition Method

Customization to fit your equipment is also possible! Efficient analysis even for complex models.

"Particle-PLUS" is a simulation software suitable for research, development, and manufacturing of devices, materials, and systems using plasma. It allows for fast results without the need to simulate the entire device by combining axisymmetric models and mirror-symmetric boundary conditions. It supports both 2D (two-dimensional) and 3D (three-dimensional) analyses, enabling efficient analysis even for complex models. 【Features】 ■ Specializes in low-pressure plasma analysis ■ Allows for fast results without the need to simulate the entire device by combining axisymmetric models and mirror-symmetric boundary conditions ■ Excels in plasma simulation for low-pressure gases, which are difficult to compute with fluid models ■ Supports both 2D (two-dimensional) and 3D (three-dimensional) analyses, enabling efficient analysis even for complex models ■ Customization to fit customer devices is possible as a strength of in-house developed software *For more details, please refer to the PDF document or feel free to contact us.

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[Example] Particle-PLUS: 3D Opposing Target Type Putter

[Example] Particle-PLUS: 3D Opposing Target Type Putter

Introduction to Particle-PLUS Analysis Case: "Counter Target Type Putter (3D Analysis)" Simulation Case

This is an analysis case of a counter-target sputtering method, which is one of the film deposition techniques that causes low damage to the substrate. 3D calculations have a higher computational cost compared to 2D calculations, but they allow for simulations that take into account more complex shapes and their effects. ◇ Features of 'Particle-PLUS' - Specializes in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, results can be obtained quickly without the need to simulate the entire device. - Excels in plasma simulations in low-pressure gases, where calculations using fluid models are challenging. - Supports both 2D and 3D, allowing for efficient analysis even with complex models. - As a strength of our in-house developed software, customization to fit the customer's equipment is also possible. ◆ Various calculation results can be output ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Density distribution/temperature distribution/velocity distribution of neutral gas and more. *Please feel free to contact us for more details.

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[Example] Particle-PLUS DC Magnetron Sputter 3D

[Example] Particle-PLUS DC Magnetron Sputter 3D

"Particle-PLUS" specializes in plasma analysis within vacuum chambers and can quickly perform simulations such as film deposition rates.

"Particle-PLUS" is a simulation software suitable for research, development, and manufacturing of devices and materials using plasma. - It specializes in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can quickly obtain results without the need for full device simulations. - It excels in plasma simulations for low-pressure gases, where calculations with fluid models are challenging. - It supports both 2D and 3D, allowing efficient analysis even for complex models. - As a strength of our in-house developed software, customization to fit the customer's equipment is also possible. ◆ Supports various applications ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitive coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us.

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Example: Particle-PLUS: GEC-CCP Device Plasma Analysis

Example: Particle-PLUS: GEC-CCP Device Plasma Analysis

Introduction to Particle-PLUS Analysis Case: "Plasma Analysis of GEC-CCP Device" 3D Simulation Case

This is a 3D analysis case related to CCP (Capacitively Coupled Plasma) etching, which is one of the representative dry etching methods. Particle-PLUS specializes in plasma analysis within vacuum chambers and can perform simulations of etching rates and other parameters at high speed. ◇ Features of 'Particle-PLUS' - Excels in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can obtain results quickly without the need for full device simulations. - Specializes in plasma simulations for low-pressure gases, where fluid modeling is challenging. - Supports both 2D and 3D, allowing efficient analysis even for complex models. - As a strength of our in-house developed software, customization to fit customer devices is also possible. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Density distribution/temperature distribution/velocity distribution of neutral gas and more. *For more details, please feel free to contact us.

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Plasma analysis of the Particle-PLUS simultaneous sputtering device.

Plasma analysis of the Particle-PLUS simultaneous sputtering device.

Analysis of dual magnetron sputtering considering the correct shape is possible.

The particle-based plasma analysis software 'Particle-PLUS' developed by Wavefront Inc. can analyze simultaneous magnetron sputtering in devices where the substrate and target are not in equilibrium. With the cut cell creation feature, it allows for high-precision electric field calculations characteristic of orthogonal grids while considering accurate shapes and normal directions. *For more details, please download the PDF or feel free to contact us.*

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Analysis of thin film formation on Particle-PLUS microtrench

Analysis of thin film formation on Particle-PLUS microtrench

It is possible to analyze the film formation process from both macro and micro scales.

The particle method plasma analysis software "Particle-PLUS," developed by Wavefront Inc., can analyze magnetron sputtering even in cases where there are microtrench structures on the substrate. "Particle-PLUS" is capable of simulating the film deposition process by calculating both the macro scale for the entire sputtering device on a substrate that includes microtrench structures and the micro scale for the areas with microtrench. *For more details, please download the PDF or feel free to contact us.*

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[Case Study] 3D Analysis of the "Particle-PLUS" CCP Device

[Case Study] 3D Analysis of the "Particle-PLUS" CCP Device

Introduction to Particle-PLUS Analysis Case: "Three-Dimensional Analysis of Capacitively Coupled Plasma (CCP)" Simulation Case

"Particle-PLUS" is a simulation software suitable for the research, development, and manufacturing of devices and materials using plasma. - It specializes in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can quickly obtain results without the need for a full simulation of the entire device. - It excels in plasma simulation for low-pressure gases, where calculations using fluid models are challenging. - It supports 2D (two-dimensional) and 3D (three-dimensional) analyses, allowing for efficient analysis of complex models. - As a strength of our in-house developed software, customization to fit the customer's device is also possible. ◆ Supports various cases ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitively coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us.

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[Example] 'Particle-PLUS' RF Magnetron Sputtering

[Example] 'Particle-PLUS' RF Magnetron Sputtering

An example of the 'Particle-PLUS' analysis of RF magnetron sputtering, which is one of the film formation methods for dielectric films using process plasma.

"Particle-PLUS" is a simulation software suitable for research, development, and manufacturing of devices and materials using plasma. - It specializes in plasma analysis within vacuum chambers and can perform simulations of deposition rates at high speeds. - It excels in low-pressure plasma analysis. - It is proficient in plasma simulations of low-pressure gases, where calculations using fluid models are challenging. - It supports both 2D and 3D, allowing for efficient analysis even with complex models. - As a strength of our in-house developed software, customization to fit the customer's equipment is also possible. ◆ Supports various applications ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitive coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us.

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[Case Study] Plasma Analysis of "Particle-PLUS" Dual Frequency CCP

[Case Study] Plasma Analysis of "Particle-PLUS" Dual Frequency CCP

Introduction to Particle-PLUS Analysis Case: "Plasma Analysis of Dual Frequency CCP" Simulation Case

This is a case study on plasma analysis of CCP (Capacitively Coupled Plasma) devices. Particle-PLUS specializes in plasma analysis within vacuum chambers and can perform high-speed simulations even when there are multiple electrodes or when applying overlapping frequencies. ◇ Features of 'Particle-PLUS' - Excels in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can quickly obtain results without the need for full device simulations. - Specializes in plasma simulations for low-pressure gases, where fluid modeling is challenging. - Supports 2D (two-dimensional) and 3D (three-dimensional) analyses, efficiently handling complex models. - As a strength of our in-house developed software, customization to fit customer devices is also possible. ◆ Various calculation results can be output ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Density distribution/temperature distribution/velocity distribution of neutral gas and more. *For more details, please feel free to contact us.

  • Etching Equipment
  • Wafer
  • Ashing device
  • Plasma Analysis Software

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[Case Study] Cleaning Process Using Particle-PLUS: CCP

[Case Study] Cleaning Process Using Particle-PLUS: CCP

Introduction of Particle-PLUS Analysis Case: "Cleaning Process by CCP" Simulation Case

This is an analysis case regarding CCP (Capacitively Coupled Plasma) etching, which is one of the representative dry etching methods. Particle-PLUS specializes in plasma analysis within vacuum chambers and can perform simulations of etching rates and other parameters at high speed. ◇ Features of 'Particle-PLUS' - Excels in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, results can be obtained quickly without the need for full device simulations. - Specializes in plasma simulations for low-pressure gases, where fluid modeling is challenging. - Supports both 2D and 3D, allowing for efficient analysis even with complex models. - As a strength of our in-house developed software, customization to fit customer devices is also possible. ◆ Various calculation results can be output ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Density distribution/temperature distribution/velocity distribution of neutral gas and more. *For more details, please feel free to contact us.

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[Example] Particle-PLUS Opposing Target Sputtering

[Example] Particle-PLUS Opposing Target Sputtering

Introduction of analysis examples using "Particle-PLUS": "Opposing Target Sputtering"

"Particle-PLUS" is a simulation software suitable for the research, development, and manufacturing of devices and materials using plasma. - It specializes in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can quickly obtain results without the need for full device simulations. - It excels in plasma simulations for low-pressure gases, where calculations with fluid models are challenging. - It supports both 2D and 3D, allowing for efficient analysis of complex models. - As a strength of our in-house developed software, customization to fit the customer's device is also possible. ◆ Supports various applications ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitively coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us.

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[Example] "Particle-PLUS" Counter Target Type Sputtering

[Example] "Particle-PLUS" Counter Target Type Sputtering

Introduction of Particle-PLUS Analysis Case: "Simulation Case of Al Thin Film Fabrication Using Face-to-Face Target"

"Particle-PLUS" is a simulation software suitable for research, development, and manufacturing of devices and materials using plasma. - It specializes in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can quickly obtain results without the need for simulations of the entire device. - It excels in plasma simulations for low-pressure gases, where calculations using fluid models are challenging. - It supports both 2D and 3D, allowing for efficient analysis of complex models. - As a strength of our in-house developed software, customization to fit the customer's device is also possible. ◆ Supports various cases ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitively coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Electron and ion density distribution/temperature distribution/generation distribution - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Neutral gas density distribution/temperature distribution/velocity distribution, etc. *For more details, please feel free to contact us.

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[Example] Mass analysis of the "Particle-PLUS" ion beam.

[Example] Mass analysis of the "Particle-PLUS" ion beam.

Introduction to Particle-PLUS Analysis Case: "Ion Beam Mass Analysis and Electrostatic Acceleration" Simulation Case

"Particle-PLUS" is a simulation software suitable for research, development, and manufacturing of devices and materials using plasma. - It excels in low-pressure plasma analysis. - By combining axisymmetric models and mirror-symmetric boundary conditions, it can quickly obtain results without the need for full device simulations. - It specializes in plasma simulations in low-pressure gases, where calculations with fluid models are challenging. - It supports 2D (two-dimensional) and 3D (three-dimensional) analyses, allowing efficient analysis of complex models. - As a strength of our in-house developed software, customization to fit the customer's equipment is also possible. ◆ Supports various cases ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitively coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us.

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[Example] "Particle-PLUS" RF Magnetron Sputtering

[Example] "Particle-PLUS" RF Magnetron Sputtering

Introduction to Particle-PLUS Analysis Case: "RF Magnetron Sputtering Analysis" Simulation Example

This is an analysis case of RF magnetron sputtering, which is one of the film deposition methods using process plasma. Particle-PLUS specializes in plasma analysis within vacuum chambers and can quickly simulate deposition rates and other parameters. ◇ Features of 'Particle-PLUS' - Excels in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, results can be obtained quickly without the need for full device simulations. - Specializes in plasma simulations for low-pressure gases, where fluid modeling is challenging. - Supports 2D (two-dimensional) and 3D (three-dimensional) analyses, efficiently handling complex models. - As a strength of our in-house developed software, customization to fit customer devices is also possible. ◆ Various calculation results can be output ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Density distribution/temperature distribution/velocity distribution of neutral gas and more. *For more details, please feel free to contact us.

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[Example] Particle-PLUS: RF Magnetron for Dielectric Targets

[Example] Particle-PLUS: RF Magnetron for Dielectric Targets

Introduction of Particle-PLUS Analysis Case: "RF Magnetron Sputtering Analysis of Dielectric Target" Simulation Case

This is an analysis case of RF magnetron sputtering, which is one of the film deposition methods using process plasma. Particle-PLUS specializes in plasma analysis within vacuum chambers and can quickly simulate deposition rates and other parameters. ◇ Features of 'Particle-PLUS' - Excels in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can obtain results quickly without the need for full device simulations. - Specializes in plasma simulations in low-pressure gases, where fluid modeling is challenging. - Supports 2D (two-dimensional) and 3D (three-dimensional) analyses, efficiently handling complex models. - As a strength of our in-house developed software, customization to fit customer equipment is also possible. ◆ Various calculation results can be output ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Density distribution/temperature distribution/velocity distribution of neutral gas and more. *Please feel free to contact us for more details.

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[Example] Particle-PLUS AC Magnetron Sputtering

[Example] Particle-PLUS AC Magnetron Sputtering

Introduction of analysis examples using "Particle-PLUS": "AC Magnetron Sputtering Simulation"

"Particle-PLUS" is a simulation software suitable for research, development, and manufacturing of devices and materials using plasma. - It specializes in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can quickly obtain results without the need for full device simulations. - It excels in plasma simulations for low-pressure gases, where calculations using fluid models are challenging. - It supports 2D (two-dimensional) and 3D (three-dimensional) analyses, allowing for efficient analysis of complex models. - As a strength of our in-house developed software, customization to fit the customer's equipment is also possible. ◆ Supports various applications ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitively coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us.

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Semiconductor plasma analysis software 'Particle-PLUS'

Semiconductor plasma analysis software 'Particle-PLUS'

"Particle-PLUS" is a plasma and rarefied fluid analysis software that excels in ICP and CCP analysis using particle methods.

"Particle-PLUS" is software suitable for research and development of devices using plasma, compatible with ICP and CCP. - Excels in simulations of low-pressure gases where fluid modeling is difficult - Calculation functions for inductive heating for ICP simulations - Advanced physical model analysis such as CCP and external circuit models - Capable of simultaneously simulating ICP and CCP - Supports 2D and 3D, efficiently analyzing complex models - As a strength of our in-house developed software, customization to fit customer devices is possible ◆ Supports various cases ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitively coupled plasma (CCP) - Dielectric barrier discharge (DBD), etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us at sales@wavefront.co.jp.

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